SPAR 3D Expo and Conference 2018

SPAR 3D Expo and Conference will take place on 5th to 7th of June 2018 at Anaheim Convention Center in California, USA.

It is the only vendor-neutral conference and exhibition focused on end-to-end 3D business and technology considerations for process and power, oil and gas, AEC (architecture/engineering/construction), surveying and mapping, transportation and civil infrastructure, law enforcement, digital historic preservation, industrial facilities, and much more!

Visit RIEGL USA (www.rieglusa.com) at their booth no. 501 to learn more about industry-leading RIEGL Waveform-LiDAR technology. Come and see the RIEGL VZ-400i and VZ-2000i Terrestrial Laser Scanners, the VMX-2HA Dual Scanner Mobile Mapping System, the miniVUX-1DL and the miniVUX-1UAV integrated on a DJI-M600 with RIEGL Integration Kit 600 onsite!

RIEGL is looking forward to a successful conference and to welcoming you in Anaheim!

More about the SPAR 2018 at: www.spar3d.com/event/